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The Latest Breaking News from TSMC

TSMC Offers a Peek at 'Global Gigafab' Process Replication Program

At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its multiple gigafab sites. The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented…

AnandTech

Unusual Options Activity in Taiwan Semiconductor ADRs Today Highlight Its Value

Last week Taiwan Semiconductor, a large semiconductor fabrication company, said its April revenue spiked. Call options in TSM stock are having unusual activity today, underlining its underlying value.

Barchart

TSMC will retain leading-edge production tech and trade secrets in Taiwan, says new national tech minister

As TSMC is becoming a multinational corporation, Taiwanese government expects TSMC to be primarily Taiwanese company.

Tom’s Hardware

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Taiwan chip companies can turn off manufacturing if Chinese troops show up

China refuses to rule out an invasion, so the US wants assurances that manufacturing can be turned off from anywhere.

TechRadar

The world's largest chipmaker could flip a kill switch and remotely disable its machines in the event of an invasion

That's one helluva kill switch.

PC Gamer

iPhone and Mac chipmaker TSMC can disable its factories should China invade Taiwan amid ongoing tensions between the two countries

Apple partner TSMC can remotely disable the machines it uses to produce chips for Apple and other US companies should China choose to invade Taiwan. The news comes following concerns about what might happen should an invasion take place.

iMore

TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company…

AnandTech

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TSMC’s EUV machines are equipped with a remote self-destruct in case of an invasion

ASML and TSMC have added kill switches to advanced EUV lithography machines to prevent them from falling into the wrong hands.

Tom’s Hardware

TSMC struggles to meet demand for CoWoS packaging, holding back AI and HPC chip production: report

TSMC can barely meet demand for AI processors, as they need larger interposers.

Tom’s Hardware

Apple COO Reportedly attends secret meetings with TSMC to reserve first batch of 2-nanometer production

Rumors of Apple developing its own AI servers seem much more feasible using TSMC's 2-nanometer fabrication process.

Tom’s Hardware

iPhone 17's major processor upgrade one step closer — top Apple exec visits Taiwan to secure vital 2nm supply

A new report claims Apple COO Jeff Williams has visited Taiwan to help Apple secure vital 2nm chip supply.

iMore

Windows on ARM FAQ: What it is, how ARM processors differ from CPUs, ARM history, and more

Windows on ARM typically makes for lightweight devices with long battery life and stellar reliability. But what exactly is ARM anyway?

Windows Central

TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry

Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how…

AnandTech

New AMD Zen 6 rumors suggest a super small yet efficient TSMC 2nm process and 2026 release date

Prominent hardware leaker Moore's Law is Dead's alleged insider source has some new information about AMD Zen 6.

TechRadar

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Top News

Taiwan Shifts Focus To US Amid China Tensions

Taiwan shifts focus from China to U.S., strengthening economic ties and diversifying investments amidst escalating tensions.

International Business Times

Rapidus 'Last Opportunity' To Put Japan Back On Global Chip Map

Japan's Rapidus project that brings together some of the world's biggest companies is the "last opportunity" to put the country's once-dominant semiconductor sector back on the global map, its chairman warned.

The Independent UK

Taiwan is selling more to the US than China in major shift away from Beijing

Taiwan is reducing its reliance on the Chinese mainland as it seeks to insulate itself from pressure from Beijing and forge closer economic and trade ties with the United States

AnandTech

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects…

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Tom’s Hardware

Ampere announces 256-core 3nm CPU, unveils partnership with Qualcomm

Ampere plans to launch 256-core AmpereOne processors at 3nm next year.

Tom’s Hardware

TSMC's third generation 3nm node on track — N3P mass production to begin later this year

TSMC will start mass producing chips on its N3P node this year as the N3E fabrication process ramps. This will be the third generation of "3nm" class nodes from the company.

Tom’s Hardware

TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes

TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.

Tom’s Hardware

Truck driver dies after ‘explosion’ at TSMC Arizona

A truck driver has died after an accident at a TSMC plant in north Phoenix. 41-year-old Cesar Anguiano-Guitron was rushed to hospital after a high-pressure waste tank valve ‘explosion’ knocked him over 20ft from his truck but updated reports say he passed away.

AnandTech

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are…

AnandTech

TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year

As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to…

TechRadar

Samsung's fiercest rival unveils mobile storage chip that will make phones and laptops faster — SK Hynix claims that its ZUFS tech will boost local AI inference without consuming more resources

Samsung's chief rival SK Hynix has developed a next-generation mobile NAND called ZUFS 4.0.

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