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The Latest Breaking News from OSAT

ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)

SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics, a subsidiary of ISDN Holdings Limited (SGX: I07 / 1656.HK), has launched its next generation High-speed Laser Marker for semiconductor chip packages, with a dual value proposition of delivering 2.5x higher marking speed and occupying 22% less physical footprint.

AAP

Tata Electronics plans to start chip packaging at upcoming Assam unit

While the Tata Group company has already initiated small-scale shipments from its first commercial OSAT facility in Vemagal, Karnataka, the strategic pivot to the greenfield high-volume manufacturing unit in Jagiroad, Assam is aimed at building trust among global clients about the company’s capabilities while ensuring immediate scalability to meet surging…

The Economic Times

Camtek Q1 Earnings Call Highlights

Camtek (NASDAQ:CAMT) reported first-quarter revenue of $121.7 million, slightly ahead of its guidance, as management pointed to strong demand tied to artificial intelligence, high-bandwidth memory and advanced packaging applications. Chief Executive Officer Rafi Amit said approximately 50% of quart

MarketBeat

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Global semiconductor foundry market hit a record $320 billion in 2025 as TSMC pulled further ahead

The global semiconductor foundry market generated a record $320 billion in revenue in 2025, growing 16% year-over-year, according to Counterpoint Research's Foundry Market Supply Tracker.

Tom’s Hardware

US to boost chip packaging capacity with CHIPS Act grant — Amkor to receive $600 million for advanced chip packaging facility

Amkor gets $600 in grants and loans to build an advanced packaging facility in Arizona that will support TSMC's fab in the state.

Tom’s Hardware

Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple

Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S. Carrying a price tag of around 2 billion dollars, the plant in Arizona will primarily serve to package chips produced by…

AnandTech

China Ramps Multi-Chiplet Efforts with Industry Heavyweights

Huawei, JCET, Verisilicon, NationalChip, and Tongfu can support Chinese chiplet efforts.

Tom’s Hardware

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